- Die & Wafer
- +Supplier Line Card
- Alliance Memory
- Analog Devices
- Apogee Semiconductor
- Analog Power
- Avalanche Technology
- Central Semiconductor
- Diodes Incorporated
- Cypress
- Everspin Technologies
- Interfet
- International Rectifier
- ISOCOM Limited
- ISSI
- Knowles
- Linear Integrated Systems
- MACOM Technology
- Microchip
- Micron Technology
- NXP Semiconductors
- On Semi
- Renesas
- Samsung Semiconductors
- SemiQ Inc.
- Semicoa
- Texas Instruments
- +Supplier Line Card
- Transys
- Vishay
- VPT Components
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Multi-Chip Modules (MCMs)
- Wafer Bumping & WLP
- Design, Packaging & Assembly
- Assembly Services
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
Everspin Technologies, Inc. is the worldwide leader in designing, manufacturing and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-Torque MRAM (ST-MRAM) into markets and applications where data persistence and integrity, low latency and security are paramount.
Together, Micross can provide customers with Everspin’s MRAM products in die & wafer form.
- With over 50 Million MRAM and ST-MRAM products deployed in data center, possess expertise supporting the MRAM market across all segments, from Automotive, Industrial, Commercial, Space to Aerospace & Defense
- Everspin has built the strongest and fastest growing foundation of MRAM users in the world
Parallel MRAM
- SPI MRAM