- DLA/DSCC Certified Products
- QML/SMD 5962
- Function
- MIL-STD-1553
- Memory
- Logic Devices
- Analog
- Nuclear Event Detector (NED)
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Micross has the expertise to characterize and reverse engineer devices, along with broadest access to source functionally equivalent die.
Offers the Sourcing EOL/LTB Die & Wafer
Obsolescence Management for OEMs when Parts Go EOL
- If required parts available – source/procure to support program needs with Lifetime Buy Management service - See EDSP
- If unavailable – source/procure similar commercial parts if this is an acceptable alternative for the OEM
- Identify PIN compatible components for upscreening
- Diminishes cost in redesigning component
- Reduces production delays and down-time
Characterizing and Sourcing
3rd Party Equivalent Die
- If the die is not available, but we are provided with a sample to characterize, Micross will source a functionally equivalent die and utilize our advanced capabilities to manufacture a form-fit-function packaged equivalent product to SMD and other required quality levels.
- The mechanical footprint and electrical specifications required by the application are maintained, solving DMS and avoiding costly re-designs.