- Global
- +North America
- Die & Wafer
- Micross LAX - Los Alamitos, CA
- Micross MCO - Apopka, FL
- Micross SFO - Milpitas, CA
- Products & Services
- Micross BOS - Shirley, MA
- +North America
- Micross FLL - Sunrise, FL
- Micross ICT - Wichita, KS
- Micross MCO - Apopka, FL
- Micross MFE - Reynosa, MX
- Micross RDU - Raleigh, NC
- Micross SFO - Milpitas, CA
- Micross SJC - San Jose, CA
- Micross TPA - Clearwater, FL
- Component Modification
- Micross AUS - Round Rock, TX
- Micross MHT - Manchester, NH
- Die & Wafer
- Micross NWI - Norwich, UK
2.5/3D Hetergeneous Integration, Wafer Bumping & WLP
Micross RDU, in Raleigh, North Carolina, offers advanced packaging and 3D integration solutions that enable higher-performance systems with decreased size, weight, and power (SWaP). Micross RDU houses an ITAR-registered microfabrication facility that allows us to provide development, custom (flexible) prototyping and production services for our customers. We provide a comprehensive array of advanced interconnect technologies for realizing your next-generation electronic systems.
Micross AIT is accredited by the Defense Microelectronics Activity (DMEA) as a Microelectronics Trusted Source provider for Post CMOS Processing Services (Category 1A).










