- Global
- +North America
- Die & Wafer
- Micross LAX - Los Alamitos, CA
- Micross MCO - Apopka, FL
- Micross SFO - Milpitas, CA
- Products & Services
- Micross BOS - Shirley, MA
- +North America
- Micross FLL - Sunrise, FL
- Micross ICT - Wichita, KS
- Micross MCO - Apopka, FL
- Micross MFE - Reynosa, MX
- Micross RDU - Raleigh, NC
- Micross SFO - Milpitas, CA
- Micross SJC - San Jose, CA
- Micross TPA - Clearwater, FL
- Component Modification
- Micross AUS - Round Rock, TX
- Micross MHT - Manchester, NH
- Die & Wafer
- Micross NWI - Norwich, UK
Component Modification Services
Micross AUS in Round Rock utilizes proprietary robotic processes to deliver guaranteed BGA reballing yields and industry-leading turnaround times. Micross’ proprietary BGA pad preparation and sphere attachment processes can be customized quickly, ensuring proper package and sphere tolerances are met for each BGA, thus creating the highest possible yield for each reballing job. Micross AUS component modification services include:
- BGA Reballing and Converting RoHS BGAs to SnPb or SnPb to SAC 305
- Ball Attach to DSBGA, WL/LFCSP, LGA, QFN and DFN Packages
- LGA Gold Removal & Reballing
Location
+1 (888) 400 5868
Component Modification
BGA Reballing
A process that flushes all-lead free balls and alloy residue from the pads and replaces them with Tin-Lead balls
More info
