- Global
- +North America
- Die & Wafer
- Micross LAX - Los Alamitos, CA
- Micross MCO - Apopka, FL
- Micross SFO - Milpitas, CA
- Products & Services
- Micross BOS - Shirley, MA
- +North America
- Micross FLL - Sunrise, FL
- Micross ICT - Wichita, KS
- Micross MCO - Apopka, FL
- Micross MFE - Reynosa, MX
- Micross RDU - Raleigh, NC
- Micross SFO - Milpitas, CA
- Micross SJC - San Jose, CA
- Micross TPA - Clearwater, FL
- Component Modification
- Micross AUS - Round Rock, TX
- Micross MHT - Manchester, NH
- Die & Wafer
- Micross NWI - Norwich, UK
Component Modification Services
Micross MHT in Manchester pioneered Robotic Hot Solder Dip (RHSD) Technology in 1984, and is supported by an in-house team of experienced technicians that have dedicated over 35 years to mastering component preparation solutions with RHSD. Micross MHT offers unmatched technical depth with quick-turn robotic solutions and other component modification services, including :
- Lead Attach, Lead Forming and Reconditioning
- Gold Removal and Restoration of Solderability
- RoHS Compliance - Removes SnPb & Replaces it with SAC305 or Specified Alloy
- Post-Process Testing - Solderability, XRF Solder Characterization, Ionic Cleanliness
- Proprietary Ultra-Fast Finish for Bottom Termination Packages (QFN, MLF, LCC)
Location
(603) 893 9900
Component Modification
Robotic Hot Solder Dip (RHSD)
Eliminates the risk of tin whiskers without damaging the component
More infoLead Attach
Proprietary process developed to maintain the integrity of component-to-PCB solder joints under stress
More infoTrim/Form & Reconditioning
Choose from various shipment options with the ability to customize specifications
More infoPCB Solutions
Providing a full-turnkey solution sustaining your program by enabling the use of existing components and boards
More infoSupport Solutions
Providing a full turnkey solution for modifying, testing, and preparing components for our customers
More info
