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Source Discontinued Texas Instrument Die & Wafer

Micross will continue to support these discontinued products by managing remaining wafer and die inventory. However, due to limited availability and the absence of an official LTB, we strongly urge you to review your current and projected demand immediately.

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Searching for a Tariff-Free US OSAT Provider?

As the largest in the US, Micross empowers manufactures to sidestep risks, bypass delays, and cut additional costs all while enjoying Tariff-Free procurement!

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Maximizing DC-DC Power Supply for Space
Webinar Recording

In this webinar, industry experts in hi-rel power electronics design, packaging, testing, and qualification of hybrid and space-grade PCB DC-DC power supplies, will provide the latest options and the best practices in realizing the optimal power suppliers for today's high-reliability applications.

Recorded May 2nd, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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Hi-Rel Power Solutions Celebrates Grand Opening in Denmark
Event

This new facility in Ballerup is a major upgrade from our former site, housing a 9,000 sq/ft design center and test lab, including a dedicated setup for EMC testing; and our new 7,500 sq/ft manufacturing operations, outfitted with the latest and most advanced production equipment.

March 11, 2025

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Device Characterization

Micross provides a comprehensive array of complete Turnkey Test & Device Characterization solutions inclusive of the following capabilities:

 

Test Program Development
  • Multiple platform expertise
Characterization
  • High-speed yield optimization
Wafer Sort/Wafer Probe
  • Up to 300mm wafer probe
Production Test
  • Full IC package testing and hybrid testing. Wafer-level testing. High-speed, multi-site delivery
Program Conversion
  • Technology migration to improve cost effectiveness

Micross’ in-house technically-advanced engineering team can support all technologies, including RF, digital, linear, analog mixed signal and memory.

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