- DLA/DSCC Certified Products
- QML/SMD 5962
- Function
- MIL-STD-1553
- Memory
- Logic Devices
- Analog
- Nuclear Event Detector (NED)
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
When Military or Space grade products are not available, Micross will recondition COTS product to OEM specifications.
Component Solutions
Re-tin ROHS compliant parts where leaded interconnects are required
- Robotic Hot Solder Dip
- BGA Reballing
Lead Attach
- Lead Attach to ceramic or plastic Leadless Chip Carrier
- Lead Replacement
- CGA Attach
Reform leads to OEM specification
- Trim & Form
- Reconditioning of bent or damaged leads
Packaging
- Lead Attach to ceramic or plastic Leadless Chip Carrier
- Tape and Reel
- 3D Scan
- Bake and Package
- Marking & Labeling
PCB Solutions
- Rework & Repair enabling Non-working qualified PCBs to be reused
- Specializing in package-on-package, LGA, QFN, CSP and other challenging components
- Adhere to IPC-7711/7721 rework standards
- 4-point inspection on each component placed
- 5D X-ray, used to locate & address the most difficult manufacturing and reworking issues
- Trace modification in inaccessible areas, under BGAs or other sensitive components
- Repair damaged traces and solder mask, incorrectly installed components, defects
- Restore pad sites for any component, including fine-pitch and variable-pitch BGAs, QFNs, and package-on-package stacks
- Removal and replacement of BGA, Micro BGA, and flip-chip, plus the majority of fine-pitch components