Searching for a Tariff-Free US OSAT Provider?

As the largest in the US, Micross empowers manufacturers to sidestep risks, bypass delays, and cut additional costs all while enjoying Tariff-Free procurement!

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DC-DC Power Supplies

Leader in power management solutions for hi-rel and space applications with the most comprehensive array of ruggedized hermetic hybrids and rad-hard PCB

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Space

Complete range of hermetic & non-hermetic components for space, with end-to-end services, including packaging, ruggedization, screening and qualification

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Aerospace & Defense

Complete range of components, semiconductors, and end-to-end services, including packaging, testing, qualification, ruggedization, and DMSMS sustainment

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Energy

Complete range of hermetic components, semiconductors and end-to-end services, including packaging ruggedization, screening and qualification

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Medical

Complete range of semiconductors, hermetic components and end-to-end services, including packaging ruggedization, screening and qualification

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White Paper

The Key to Advanced Packaging Supply Chains for Onshore Microelectronics Production

With more than 90% of outsourced semiconductor assembly and test (OSAT) manufacturing performed outside the U.S., rising geopolitical tensions and trade levies are driving U.S.-based OEMs and contract manufacturers (CMs) to reevaluate their microelectronic supply chains. Amidst this shift, many companies that produce mission-critical components for the aerospace and defense industries are considering U.S. onshoring. Download our white paper to learn how to overcome these challenges. More info

Announcement

Micross Appoints Jim Cannon as President and Chief Executive Officer

March 16, 2026

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Press Release

Class H+ DC-DC Converters for LEO & NewSpace

March 3, 2026

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New Product

Micross Launches Standard-Performance NED

February 4, 2025

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More News & Info

The Most Complete Provider of…
Hi-Rel Microelectronics & Services

Die & Wafer

The World’s Largest Franchised Offering of Die, Wafer & Value Added Services

  • Die & Wafer Distribution
  • Thinning, Saw, Sort, Inspect
  • Wafer Bumping
  • Long Term Die/Wafer Storage
  • EOL Die Sustainment (EDSP)
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Hi-Rel Power

Leader in Power Management Solutions for Hi-Rel and Space Applications

  • Aerospace & Defense Hybrid DC-DC Converters
  • Space-Grade Hybrid & PCB DC-DC Converters
  • EMI Filters
  • Discrete Diodes
  • ISOPAC® Assemblies
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Hi-Rel Components

QML Certified Supplier for MIL-PRF-38535, MIL-PRF-38534, & MIL-PRF-19500

  • Memory, Analog, Logic & RF/mW
  • CSP/Plastic & Hermetic Package
  • ASIC Design, Wafer Level Packaging, MCMs
  • Advanced Packaging, 2.5/3D Heterogeneous Integration
  • MIL-STD-1553 and Data Bus Couplers & Harnesses
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Testing & Qualification

DMEA Trusted Source & an Extensive Array of Testing Services

  • Counterfeit Mitigation
  • PEMS Qualification & Up-screening
  • Component Test/Inspection & Qualification
  • RF & Digital, Electrical & Environmental Test
  • Burn-In, ACBI & Mechanical Reliability Test
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Component Modification

Leader in Component Modification with Best-in-Class Proprietary Processes

  • BGA Reballing & Robotic Hot Solder Dip
  • Trim, Form, Reconditioning
  • Lead Attach
  • CGA Interconnects
  • Marking, Labeling, & Kitting
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EOL/DMSMS Sustainment

Complete Program Sustainment from Initial Production through Post-EOL

  • Original Qualified Products
  • Product Recreation
  • Form-Fit-Function Equivalent
  • Program Sustainment Management
  • Supplier Managed Inventory
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Local Support… Worldwide
Operations, Engineering, & Field Support

Field Support

Locations

One Source
One Solution

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