The Key to Advanced Packaging Supply Chains

For Onshore Microelectronics Production

With more than 90% of outsourced semiconductor assembly and test (OSAT) manufacturing performed outside the U.S., rising geopolitical tensions and trade levies are driving U.S.-based OEMs and contract manufacturers (CMs) to reevaluate their microelectronic supply chains. Amidst this shift, many companies that produce mission-critical components for the aerospace and defense industries are considering U.S. onshoring. However, this can be a daunting challenge as there are a limited number of OSAT service providers and most are not responsive to smaller quantity needs.

 

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