- DLA/DSCC Certified Products
- QML/SMD 5962
- Function
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- Memory
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- Wafer Bumping & WLP
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- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
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- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
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- Micro In-Line Couplers
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- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
When you need a component for benign environments, but also need to fit in small space and weight less, Micross offers a low cost, complex package technique with Chip on Board. With the Chip on Board technique, your components will still reach Moisture Sensitivity Level 4 or higher and support operating temperature of more than 105°C. Shown below is a Glob-Top component which can be avoided with our Chip on Board technique leaving no repair requirements.
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Chip on Board is a Reliable Low Cost Assembly Alternative
- Facilitating integration of single or multiple active and discrete components
- Epoxy die attach (conductive or non-conductive)
- Traditional wire-bond or ribbon-bond
- Screen print solder paste for discrete electrical connection with or without Epoxy Tack down
- With glob-top component protection
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