Webinar

Optimizing Hi-Rel Power Solutions for Space & Defense… Balancing Needs, Performance & Budget
As satellite constellations expand and geopolitical demands intensify, the need for high-reliability power supplies with shorter lead times and competitive cost targets has never been greater. Designers must balance technical performance, qualification standards, and supply-chain realities to meet mission requirements in both space and defense programs.
This webinar explores emerging alternatives in hi-rel power supply that deliver the required reliability and performance while maintaining cost efficiency. Presenters—experts in high-reliability DC-DC power conversion—will share insights into the latest design methodologies, qualification processes, and packaging innovations that help system designers achieve optimal trade-offs between performance, SWaP (Size, Weight, and Power), and cost.
December 4, 2025
View RecordingThe Most Complete Provider of…
Hi-Rel Microelectronics & Services

Die & Wafer
The World’s Largest Franchised Offering of Die, Wafer & Value Added Services
- Die & Wafer Distribution
- Thinning, Saw, Sort, Inspect
- Wafer Bumping
- Long Term Die/Wafer Storage
- EOL Die Sustainment (EDSP)

Hi-Rel Power
Leader in Power Management Solutions for Hi-Rel and Space Applications
- Aerospace & Defense Hybrid DC-DC Converters
- Space-Grade Hybrid & PCB DC-DC Converters
- EMI Filters
- Discrete Diodes
- ISOPAC® Assemblies

Hi-Rel Components
QML Certified Supplier for MIL-PRF-38535, MIL-PRF-38534, & MIL-PRF-19500
- Memory, Analog, Logic & RF/mW
- CSP/Plastic & Hermetic Package
- ASIC Design, Wafer Level Packaging, MCMs
- Advanced Packaging, 2.5/3D Heterogeneous Integration
- MIL-STD-1553 and Data Bus Couplers & Harnesses

Testing & Qualification
DMEA Trusted Source & an Extensive Array of Testing Services
- Counterfeit Mitigation
- PEMS Qualification & Up-screening
- Component Test/Inspection & Qualification
- RF & Digital, Electrical & Environmental Test
- Burn-In, ACBI & Mechanical Reliability Test

Component Modification
Leader in Component Modification with Best-in-Class Proprietary Processes
- BGA Reballing & Robotic Hot Solder Dip
- Trim, Form, Reconditioning
- Lead Attach
- CGA Interconnects
- Marking, Labeling, & Kitting

EOL/DMSMS Sustainment
Complete Program Sustainment from Initial Production through Post-EOL
- Original Qualified Products
- Product Recreation
- Form-Fit-Function Equivalent
- Program Sustainment Management
- Supplier Managed Inventory
Local Support… Worldwide
Operations, Engineering, & Field Support







